Surface modifying carbon nanotube material, manufacturing method therefor, electronic component and electronic device

ABSTRACT

A carbon nanotube material is exposed to ultraviolet rays, and a silicon-containing compound capable of modifying the surface of the carbon nanotube material in combination with the ultraviolet rays is supplied to thereby modify the surface of the carbon nanotube material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.12/052,265, filed Mar. 20, 2008, and is based upon and claims thebenefit of priority from the prior Japanese Patent Application No.2007-83836, which was filed on Mar. 28, 2007, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a surface modification technique for acarbon nanotube material.

2. Description of the Related Art

In recent years, carbon nanotubes (CNTs) are being studied forelectronic components with the properties of electrical conductors andthermal conductors in the field of semiconductor devices andsemiconductor integrated circuit devices including printed wiringboards.

There is particular interest in CNTs as materials for formingsemiconductor devices because of their excellent chemical stability,unique physical and electrical properties and other characteristics, andvarious researches are continuing into means of controlling theirthickness and length, formation position, chirality and the like.

Specific applications of interest include electromagnetic shieldingmaterials in electronics, cooling bump component materials for ultra-LSIand other advanced electronic devices, and structural components for thewiring vias of semiconductor devices (electronic devices) and the like.

For example, one application that is being considered to exploit theextremely good thermal conductivity of CNTs is to grow them at highdensities on semiconductor process boards or to scatterpreviously-synthesized CNTs on boards to thereby form and mount CNTparts which can be used as adhesive structures for semiconductor devices(electronic devices) mounted on some electrically conductive circuitsand process boards, and exhaust heat paths (so called “bump structures”)for the device heat discharged by the adhesive structures.

Furthermore, the extremely good electrical conductivity of CNTs couldmake them useful for application to the via wiring structural body ofthe high-density wiring structures of semiconductor devices havingultrafine structures.

FIG. 5 shows one example of a structure (see for example Fujitsu Ltd.,Fujitsu Laboratories Ltd., “Fujitsu Pioneers Use of Carbon Nanotubes forHeatsinks for Semiconductors”, 5 Dec. 2005 (searched 18 Aug. 2006),http://www.fujitsu.com/global/news/pr/archives/month/2005/20051205-01.html) that uses such CNTs as the cooling bump material of anadvanced electronic device. As shown in FIG. 5, regarding the coolingbump structure for such an advanced electronic device, the CNT bumpstructure can be prepared for example by depositing a catalytic metalcarrier film (such as a TiN film) and a catalytic metal film (Co or thelike) (shown together as 53 in the drawing) by sputtering or the like onelectrode 52 on substrate (aluminum nitride (AlN), alumina or the like)51, then growing CNTs 54 by thermal CVD (chemical vapor deposition)using hydrocarbon gas (CH₄, C₂H₂ or the like), and then applying aconductive substance (Cu, Al or other metal or the like) to the CNT partof the board with CNTs by plating (wet processing) or the like. Anelectronic device can then be thermo-compression bonded (preferably atabout 250 to 450° C.) on this board to prepare a highly thermallyconductive electronic device.

FIG. 1 shows one example of a wiring via structure using theaforementioned CNTs (see for example Japanese Unexamined PatentApplication Publication No. 2002-329723 (Claims) and Nihei et al.,Japanese Journal of Applied Physics, 2005, Vol. 44, p. 1626). As shownin FIG. 1, such a via structure can be prepared for example by formingunderlayer 2 and Cu wiring layer 3 on substrate 1, depositing barrierfilm (Ta film or the like) 4 on Cu wiring layer 3 to prevent scatteringof the Cu, forming insulating layer 5 on top of that, making the viahole, and then depositing catalytic metal carrier film (Ti or the like)6 and Co or other catalytic metal film (or catalytic fine particlelayer) 7 by sputtering or the like, growing CNTs 8 by thermal CVD(chemical vapor deposition) or the like using hydrocarbon gas (CH₄, C₂H₂or the like), and finally forming the upper wiring. FIG. 1 also showsfiller resin 9 for fixing CNTs 8.

However, the problem is that although the CNTs themselves have excellentelectrical conductivity, semiconductor properties, thermal conductivity,chemical stability and the like, they may not have sufficient affinityto the materials with which they come into contact, so that electricaland thermal conductivity may be greatly reduced at the connections andadequate adhesiveness and close contact between layers may not beobtained. This problem also occurs when nanotubes manufactured by CVDwith one end fixed to a Si substrate are used for wiring purposes.

One potential solution would be to achieve perfect close contact betweenthe CNTs and surrounding layers when manufacturing the component. Theproblem is, however, that such contact cannot be achieved withoutresolving the problem of poor affinity at the boundaries to the othermaterials. This problem is common to all applications of CNTs.

CNTs are conventionally manufactured by various manufacturing methodsincluding laser ablation, chemical vapor deposition (CVD), the HiPCO(high-pressure carbon monoxide) method and the like. The surfaceproperties of

CNTs manufactured by these methods are dependent on the properties ofthe graphite-like surface molecular structure, which is an electronichyperconjugated molecular structure of linked benzene rings, and arealso graphite-like in terms of wettability with other materials. Thatis, the molecular surface after manufacture (as a powder for example)without any additional treatment normally has poor dispensability in anysolvents, and even treatment under specific conditions (such asultrasonic treatment in the presence of ethanol) can only provide adispersed state for a few weeks at most.

As discussed before, this property has greatly restricted variousengineering applications of CNTs. That is, when attempting tomanufacture hybrid materials of manufactured CNTs with other materials,such as functional structural materials mixed with resins, it iscurrently difficult to manufacture a composite material with sufficientcompatibility on the microscopic level by kneading or otherwiseprocessing the CNTs with other materials without surfactants and otheradditives, and when additives are added, the properties of thesematerials inevitably have adverse effects on the composite material,resulting in, for example, poorer electrical properties, mechanicalstrength and chemical properties. Poorer electrical properties heremean, for example, increased specific resistance, decreased reliabilityof the electrical properties in the middle to long term, increasedspecific resistance relative to weight and poorer electromagneticshielding performance, as well as poorer reliability in the performance.Poorer mechanical strength means decreased rigidity and breakingstrength, as well as long-term deterioration of these properties and thelike. Poorer chemical properties mean that the material propertiesinvolving the environment (such as hygroscopicity, solvent resistant,oxidation from oxygen in the air) deteriorate over time.

For example, in order to use CNTs as via wiring materials in ultra-LSIand other high-density advanced electronic devices, the tops of CNTsgrown in a via must be shaved by CMP (chemical mechanical polishing). Inthis case, it may be necessary to fill or fix the area around the bundleof CNTs with an insulating material or the like in order to fix thebundle or prevent polishing material or liquid from infiltrating andcontaminating the CNTs during CMP (or to make it easier to remove whenit does infiltrate), but if the CNTs do not have a good affinity to theinsulating material or the like, the insulating material may notcompletely fill the spaces between CNT bundles even if a resin dissolvedin a solvent is applied by spin coating or the like, or even if a filmis formed from the resin material in a vacuum environment.

SUMMARY OF THE INVENTION

According to an aspect of an embodiment, there is a method formanufacturing a surface modified carbon nanotube material which includesmodifying the surface of a carbon nanotube material by exposing a carbonnanotube material to ultraviolet rays and supplying a silicon-containingcompound capable of modifying the surface of the carbon nanotubematerial in combination with the ultraviolet rays.

According to another aspect of an embodiment, there is a surfacemodified carbon nanotube material the surface of which is modified withat least one of a silicon-containing group and a silicon-containingcompound.

According to still another aspect of an embodiment, there is anelectronic component having any of the aforementioned surface modifiedcarbon nanotube materials and an electronic device having any of theaforementioned surface modified carbon nanotube materials.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a model horizontal cross-section of a wiring via structureusing CNTs;

FIG. 2 is a model diagram showing the principal parts of a unit of oneembodiment for exposing to VUV and supplying a specific substance;

FIG. 3 is another model diagram showing the principal parts of a unit ofone embodiment for exposing to VUV and supplying a specific substance;

FIG. 4 is a model cross-sectional view showing a semiconductorintegrated circuit device using a CNT material of one embodiment as thevias;

FIG. 5 schematically shows an example of an outline of the structure ofan electronic device comprising a highly thermally conductive bumpwherein a CNT material is applied to the cooling bump material of anadvanced electronic device; and

FIG. 6 schematically shows an outline of a preparation method in whichthe CNT material of one embodiment is applied to an advancedelectromagnetic shielding material.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention are explained below using drawings,examples and the like. These figures, examples and explanations areexamples of the present invention and do not limit the scope of thepresent invention. Other embodiments can of course be included in thescope of the present invention as long as they are consistent with itsintent.

The surface modified carbon nanotube material of one embodiment can bemanufacturing by a method that comprises exposing a CNT material toultraviolet rays and supplying a silicon-containing compound capable ofmodifying the surface of the CNT material in combination with theultraviolet rays (a silicon-containing compound capable of modifying thesurface of a CNT material in combination with ultraviolet rays is calleda specific substance, hereinbelow) to thereby surface modify the carbonnanotube material.

A novel CNT material with improved affinity in contact with anothermaterial is obtained by means of one or more embodiments. As a result,the problems of a large decrease in electrical and thermal conductivityat the connections with another material and insufficient adhesivenessand close contact between layers can be controlled. Such a material canbe used favorably in an electronic machine, electronic component or thelike.

The reason why the surface of the CNT material can be modified byexposing it to ultraviolet rays and supplying a specific substance isprobably that the substance is activated by the ultraviolet rays andgenerates chemically active species such as radicals which affect thesurface of the CNT material.

This mechanism is presumed to be as follows for example (however, thevalidity of this presumption has no bearing on the essence). That is,exposure to ultraviolet rays breaks the bonds of a specific substancethat is in a floating state near the nanotube molecules, generatingvarious radicals and other chemical species containing silicon. Aminoradicals, alkyl radicals, alkoxy radicals and other chemical speciescontaining silicon may be generated. Because these radicals and the likeare unstable and highly reactive, they rapidly bind to the relativelyreactive defect sites (5-member rings, 7-member rings, sites of unstablebonding normally called dangling bonds, etc.) on the adjacent graphenesheet of nanotubes, forming covalent bonds. In this way, the surface ofthe CNT material is modified with silicon-containing groups. Anotherpossible mechanism is one whereby the chemically active species such asradicals, rather than forming direct chemical bonds with the nanotubes,react and re-bind with each other, forming products with higher boilingpoints (low volatility), and these silicon-containing compounds areadsorbed on the surface of the CNT material, thereby modifying thesurface of the CNT material with silicon-containing compounds.

However, other mechanisms are also conceivable, such as one for examplewhereby this substance or part of it is adsorbed on the surface of theCNT material and acts on the surface of the CNT material due to theeffect of the ultraviolet rays without involving any radicals or otherchemically active species. Moreover, chemical bonds are probably theprincipal actors in the aforementioned effects, but physical adsorptionor the like may also be involved. The mechanisms and modes of actionleading to modification have no bearing on the essence.

Taken as a whole, the above can be taken to mean that the CNT materialis preferably surface modified by at least one of a silicon-containinggroup and a silicon-containing compound.

Whether or not the surface has been modified by at least one of asilicon-containing group and a silicon-containing compound can beverified by confirming the presence of silicon atoms on the surface ofthe surface modified CNT material. Alternatively, it can be verified byconfirming the presence of silicon-carbon bonds on the surface of thesurface modified CNT material. These silicon atoms or silicon-carbonbonds are preferably ones that are not greatly reduced or eliminated bysurface washing with a solvent. Their presence can be confirmed by anymethod, and for example silicon-carbon bonds can be easily confirmedfrom the XPS (x-ray photoelectron spectrum), the IR (infraredabsorption) spectrum or the like.

A silicon-containing compound can be confirmed to be a specificsubstance for the surface modified carbon nanotube material if thesurface of the CNT material is modified in some sense after exposure toultraviolet rays. When the CNT material is surface modified aftercontact with a substance even without ultraviolet rays, it can beconfirmed to be a specific substance if the degree of surfacemodification is greater with exposure.

Specifically, such surface modification can be confirmed if the surfaceof the CNT material has been modified in some sense by changes insurface tension, changes in wettability with a specific solvent,introduction of a specific group or groups (such as a polar group orgroups) on the surface of the CNT material, changes in adhesiveness witha specific material, changes in absorbed amount of a specific substanceor the like, or has been modified more than it would have been withoutultraviolet exposure. Affinity to another substance is improved as aresult of such modification.

Alternatively, as described above, since most substances capable ofgenerating chemically active species such as radicals when exposed toultraviolet are specific substances, a silicon-containing compoundcapable of generating chemically active species such as radicals whenexposed to ultraviolet can be considered a specific substance regardlessof the specific changes mentioned above. This is because if chemicallyactive species such as radicals are generated, there should logically besome sort of change in the surface of the CNT material.

It may be desirable that such chemically active species such as radicalsinclude at least either chemically active species such as an electrondonating group radical or chemically active species such as an electronattracting group radical. When such chemically active species such asradicals are involved, affinity to substances having polarity isimproved through introduction of a polar group into the CNT material.

Regarding the surface modified carbon nanotube material, a “surface” isa surface for purposes of surface modification, and may include not onlythe outer surface of the CNT material but also indentations and innersurfaces, but in the context of the present invention it is notimportant what specific part of the CNT material is modified.

The specific substance for the surface modified carbon nanotube materialis not particularly limited as long as it is a silicon-containingcompound capable of modifying the surface of a CNT material incombination with ultraviolet rays, and it may be selected from anysilicon-containing compounds. Specifically, it is preferably selectedaccording to the type of surface modification desired. Affinity tosilicon containing compounds in general can be improved by using asilicon-containing compound, but for purposes of improving affinity to apolar solvent for example, the specific substance is preferably asubstance capable of introducing a polar group on the surface of the CNTmaterial. For purposes of improving affinity to a solvent having aspecific structure, the specific substance is preferably a substancecapable of introducing that specific chemical structure or a similarchemical structure on the surface of the CNT material.

Examples of this specific substance include silanes, disilanes, silanehalides, aminosilanes, alkylsilanes and derivatives of these.

More specific examples include triisopropylsilane, triisopropylsilylchloride, triisopropylsilyl acrylate, allyltrimethylsilane,trimethylsilyl methyl acetate, vinyltrimethoxysilane,allyltrichlorosilane, 3-aminopropyltrimethoxysilane, 3-aminopropyldiethoxymethylsilane, 3-chloropropyl dimethoxymethylsilane,triethoxy-1H,1H,2H,2H, tridecafluoro-n-octylsilane, and isomers andderivatives of these.

The specific substance is supplied in order to bring it in contact withthe CNT material. It is supplied in a gaseous phase. When the specificsubstance is supplied as vapor, it may be desirable to use reducedpressure as discussed below because vapor pressure is low and vapor maybe difficult to generate at normal pressure and room temperature, toinclude an inactive substance that does not modify the surface of theCNT material even under ultraviolet exposure by diluting the specificsubstance with this inactive substance as discussed below, or to heatthe specific substance. In other words, this means that when thespecific substance is supplied as vapor, it is desirable for thespecific substance to have a certain vapor pressure at the temperatureused. The aforementioned silanes, disilanes, silane halides,aminosilanes, alkylsilanes and derivatives thereof are often desirablefrom this standpoint.

However, the specific substance does not necessarily need to be in theform of vapor. Consequently, it may be useful in some cases to supplythe specific substance in a state of suspension formed by spraying it inanother gas. In this case, the suspended specific substance maycontribute to modifying the CNT material while still in a liquid state.

When the aim is also to confer other affinities such as affinity to apolar solvent, it is desirable to include a substance capable ofintroducing polar groups or other groups that can confer such affinityonto the CNT material surface. More specifically, it is desirable tosupply the specific substance together with at least one substanceselected from hydrocarbons, oxygen, amines, alkyl halides, alcohols,ethers and mixtures of these.

In this way, singlet oxygen and other types of active oxygen, aminoradicals, alkyl radicals, alkoxy radicals and other chemical species aregenerated. Because these radicals are also unstable and highly reactive,they rapidly bind to the relatively reactive defect sites (5-memberrings, 7-member rings, sites of unstable bonding normally calleddangling bonds, etc.) on the adjacent graphene sheet of nanotubes,forming covalent bonds. Or else the chemically active species such asradicals, rather than forming direct chemical bonds with the nanotubes,react and re-bind with each other, forming products with higher boilingpoints (low volatility) that are adsorbed on the surface of the nanotubemolecules. As a result, not only can affinity to silicon-containingcompounds be improved, but so can affinities to electrically conductivesubstances, insulating substances, hydrophilic substances, lipophilicsubstances and substances having specific groups and the like.

Examples of oxygen, amines, alkyl halides, alcohols, ethers and mixturesof these include triethylamine, n-butyl chloride, isobutyl chloride,n-butyl bromide, isobutyl bromide, ethanol, 2-propanol (isopropylalcohol), acetone, diethyl ether, dichloroethane, n-hexane, cyclohexane,n-hexanone, cyclohexanone, benzene, xylene, methyl ethyl ketone (MEK),DMF (dimethyl formamide), DMSO (dimethyl sulfoxide), dimethyl acetamide,diethyl ketone, methyl isobutyl ketone (MIBK), n-methyl pyrrolidine,dichloroethane and pyridine.

Ultraviolet radiation can be classified into UV-A with a wavelength inthe range of over 315 nm to 400 nm, UV-B with a wavelength of over 280nm to 315 nm, UV-C with a wavelength of over 200 nm to 280 nm and vacuumultraviolet (VUV) with a wavelength in the range of 10 to 200 nm, andthe ultraviolet for the surface modified carbon nanotube material can beselected appropriately from these ranges. However, because the surfaceof a CNT material is normally highly stable (in chemical stability,etc.), it often cannot be modified sufficiently by exposure to UV-A,UV-B or UV-C. In this case, VUV is preferred.

The means of obtaining VUV is not particularly limited. A preferredexample is a Xe excimer UV lamp with a narrow width and a centralwavelength of 172 nm. A Xe-filled excimer lamp UV with a wavelengthdistribution of about 160 to 200 nm is normally desirable but is notnecessarily required. The compound bond-cleaving energy is directlyrelated to the wavelength of the VUV or other ultraviolet rays, and whenthere are specific bonds that should not be cleaved, it is useful tonarrowly restrict the wavelength range of the VUV or other ultravioletrays according to the object.

The VUV output is not particularly limited, either, and a commerciallyavailable output of tens of mW/cm² can be used advantageously. However,if there are no problems with cooling and installing the equipment forgenerating VUV (excimer UV lamp or the like), productivity can beimproved by using a higher output machine or arraying multiple UV lampsnear each other to thereby increase the exposure per unit area.

As its name suggests, VUV is normally used in a vacuum or under reducedpressure, but this is not necessarily the case, and normal pressure isalso an option. That is, the CNT material can be exposed to VUV while inatmosphere at normal pressure or reduced pressure.

From the practical standpoint of controlling the combined effect of theultraviolet and specific substance and allowing a larger distancebetween the ultraviolet and CNT material, it is often useful to controlthe concentration of the specific substance in the atmospheresurrounding the CNT material. This is especially important in the caseof VUV. For example, specific substances often have large absorptioncoefficients, as shown by the fact that almost all VUV is absorbedwithin 1 cm in air containing 20 vol % oxygen, so it is often desirableto reduce the concentration (or the vapor pressure or partial pressure)of the specific substance by some means. This can be achieved byadjusting the degree of vacuum of the atmosphere, but it is usuallydesirable to also use a specific substance diluted with an inactivesubstance that is a substance that does not modify the surface of theCNT material even when exposed to VUV. Specifically, the specificsubstance is diluted to preferably between 0.001 and 50 vol % or morepreferably between 0.01 and 10 vol % at normal pressure. This inactivesubstance is not particularly limited, but since the atmosphere isgaseous, a gaseous or volatile substance is normally suitable. Examplesinclude neon, argon and other inactive gasses and nitrogen gas.

The distance between the CNT material being exposed and the ultravioletsource should usually be as small as possible to facilitate absorptionof the ultraviolet. This is particularly important in the case of VUV.Depending on the types and concentrations (or on the vapor pressure orpartial pressure) of substances between the CNT material and the VUVsource, this distance is generally preferably 0.1 to 100 mm for example.In most cases, it should often be between about 0.2 mm and a few cm.

The method of ultraviolet exposure is not particularly limited. It doesnot necessarily need to occur at the same time that the specificsubstance is supplied. Examples include a method of supplying a specificsubstance continuously to a CNT material while also exposing itcontinuously to UV rays, a method of supplying a specific substanceintermittently to a CNT material and exposing it intermittently to UV inconjunction with this supply, and a method of supplying a specificsubstance intermittently to a CNT material and exposing it to UVintermittently in conjunction with the supply and continuously for acertain period of time thereafter.

It is unknown whether only those areas that are directly exposed to UVrays undergo surface modification of the CNT material. When theresulting chemically active species such as radicals are long-lived forexample, it is possible that even areas that have not been directlyexposed to UV rays may undergo surface modification. Consequently, it issatisfactory if the CNT material is surface modified as a result of UVexposure of the material as a whole, but normally it is desirable thateach individual CNT material be directly exposed to UV rays as much aspossible. In this sense, it is desirable that the CNT materials be allaligned in the same direction extending vertically from the substrate,or that they be scattered on a substrate, but these are not limitations.

The aforementioned process can be applied with part of the CNT materialsurface covered using a conventional lithography technique or the liketo thereby limit the areas of the surface to be modified, and thistechnique can also be applied multiple times so that different areas aremodified in different ways. This is useful when different areas on asubstrate are to be treated in different ways when preparing a bump forexample.

A “CNT material” for the surface modified carbon nanotube materialsignifies a CNT or a material produced by modifying a CNT in some way.Typically, it is a CNT which is a carbon nanotube having ananometer-sized cross-section (for example, a cross-sectional diameterof 0.3 to 10 nm). The length thereof is not particularly limited but canpreferably be tens of nanometers to a few millimeters.

CNTs include those that assume a band structure fulfilling theconditions for exhibiting metallic properties, and those that assume aband structure fulfilling the conditions for exhibiting semiconductor(semi-metallic) properties. Either a CNT exhibiting metallic propertiesor a CNT exhibiting semiconductor properties may be used for the surfacemodified carbon nanotube material.

A “CNT material” for the surface modified carbon nanotube material maybe a nanotube having a so-called peapod structure wherein anano-structure other than a nanotube that exhibits metallic propertiesoverall, such as a metal-containing fullerene, is packed inside a CNT.In other words, the “modification” described above includes such cases.

By using such a peapod nanotube containing another nano-structure, itmay be possible to increase the electrical conduction characteristics ormechanical strength of a via for example. For example, when the CNTscontain metal-containing fullerenes, it is known based on thefirst-principle calculations that the charge of the metal inside willappear outside the fullerenes and further outside the nanotubes, therebyimproving the electrical conduction characteristics of the via.

Rather than being contained within a nanotube, a molecule or atom or astructure other than a nanotube which exhibits metallic propertiesoverall, such as a metal-containing fullerene, can also be presentbetween adjacent nanotubes making up a single via. Such molecules oratoms or structures other than nanotubes can also be arranged betweenadjacent nanotubes that themselves contain metal fullerenes. A CNT thathas been modified in this way is also a “CNT material” for the surfacemodified carbon nanotube material.

CNTs and other CNT materials have conventionally been formed by arcdischarge or laser ablation, but currently plasma CVD (chemical vapordeposition) or thermal CVD is often used. Since the nanotubes can beformed directly on a substrate in CVD, this method offers potential forapplication to the manufacture of integrated circuits. Of course, thepresent invention is not limited by the method of manufacturing the CNTsused.

It is often desirable that the CNT material be prepared by CVD. In thiscase, the CNT material is produced on a substrate. Production of the CNTmaterial on a substrate is not itself an essential condition, but it isoften desirable for the CNT material to be produced on a substratebecause this facilitates direct exposure to UV rays and provides closecontact with the substrate as explained above.

When preparing the CNT material by CVD, the material forming thesubstrate is not particularly limited and can be selected appropriatelyfrom known materials, but it is desirable to use an electricallyconductive material when electrical conductivity is desired and athermally conductive material when thermal conductivity is desired.

There are no particular limitations on the equipment for exposing theCNT material to UV rays and supplying the specific substance. Examplesinclude equipment having the structures shown in FIGS. 2 and 3. In FIG.2, specific substance blower port 24 and supply conduit 23 for gas 22,which consists of a specific substance diluted with an inactivesubstance, are located below UV ray source 21. UV ray source 21 iscooled by cooling medium 25. Below blower port 24, substrate 27 havingbundles 26 of vertically aligned CNTs moves from left to right as shownin the drawing. FIG. 3 is similar to FIG. 2 except that the coolingmedium is replaced with water-cooling duct 31, and substrate 27 movesthrough supply conduit 23 for gas 22, which consists of a specificsubstance diluted with an inactive substance. The bundles 26 ofvertically aligned CNTs can be realized for example as bundles of CNTsgrowing in via holes. The solid arrows in FIGS. 2 and 3 indicate theflow of cooling medium 25 and gas 22, which consists of a specificsubstance diluted with an inactive substance, while the broken arrowsindicate UV rays.

The surface modified CNT material has better affinity than beforemodification when in contact with another substance. This “betteraffinity” may mean improved surface tension, improved wettability,improved adhesiveness or greater adsorptive capacity when in contactwith another substance, less foreign matter (moisture, etc.) or fewercavities (microscopic spaces) intervening between it and the othersubstance, or the like.

A primary example of the “other substance” in this case is asilicon-containing substance. That is, the surface modified CNT materialhas better affinity to a silicon-containing substance than beforesurface modification. The “silicon containing substance” here is notparticularly limited. A suitable specific substance can be selected forthe “silicon containing substance” to which the CNT material surface isto have more affinity, and the present embodiments can be appliedeffectively if the affinity to the “silicon-containing substance” isfound to have improved as a result of the treatment of the presentembodiments. In general, good affinity is easier to achieve when thereare more similarities between the chemical structures of the“silicon-containing substance” and the specific substance.

The “other substance” in this case may also be at least one substanceselected from the group consisting of the electrically conductivesubstances, insulating substances, hydrophilic substances, lipophilicsubstances and substances having specific groups. The object here is toimprove electrical connectivity, thermal connectivity and/or mechanicalbonding with other members and/or wettability with solvents, adhesivesand/or the like when the CNT material is used as a component of anelectronic device or the like, and to thereby avoiding peeling, circuitbreakage and other problems during long-term use. It may also be asilicon containing substance which is also at least one substanceselected from the group consisting of the electrically conductivesubstances, insulating substances, hydrophilic substances, lipophilicsubstances and substances having specific groups. In this case, bettereffects can often be achieved because the various kinds of affinity acttogether. Throughout the descriptions of this invention and theSpecifications, the term “specific” in “specific group”, “specificsubstance”, “specific structure”, “specific solvent”, “specific bond”,“specific material” and the like signifies not that these have beenspecifically determined but that they can be determined at willaccording to practical considerations.

Of the aforementioned silicon-containing substances, examples ofinsulating substances include SOG, TEOS (tetraethoxysilane), and socalled “Low-k resins” with or without micropores, which are insulatingmaterials used in insulating films such as interlayer insulating filmsfor semiconductor devices and which also contain silicon.

Examples of electrically conductive substances in this case includecopper, aluminum, and other metals and electrically conductivesubstances in general that are used for electronic wiring parts;examples of insulating substances include SOG, TEOS (tetraethoxysilane),polyimide resins and any other insulating resins for semiconductorseals, or the currently popular “Low-k resins”, which have lowdielectric constants and may or may not have micropores, or PFA, FEP,Teflon and other fluorine resins and other electrically insulatingmaterials in general that are suitable for fixing CNTs; examples ofhydrophilic substances include water, ethanol, methanol, phenol,dioxanes, ethylene glycol, diethylene glycol, triethylene glycol,glycerin and other alcohol solvents and the like; and examples oflipophilic substances include petroleum ether, n-hexane, cyclohexane andother paraffin solvents, benzene, toluene, xylene, cresol and otheraromatic solvents, or THF (tetrahydrofuran), 2H-Pyran (pyran),1,4-dioxane, DMF (dimethylformamide), DMSO (dimethylsulfoxide),dimethylacetamide or diethyl ketone, MIBK (methyl isobutyl ketone) andother ketones, n-methyl pyrrolidone, dichloroethane, pyridine and otherpolar solvents containing hetero elements (elements other than C, O andH). Substances having specific groups may basically be any substances(preferably low-viscosity gases or liquids) having functional groupswhich are mostly included in the aforementioned insulating substances,hydrophilic substances and lipophilic substances, and the following aresome typical examples: substances having at least one of —OH, —COOH,—NH₂, —NR₂ (wherein R is an aliphatic or aromatic alkyl group orderivative thereof), —CO—, —C═O, an imide bond and an ether bond, or inother words alcohols, phenols, carboxylic acids, amines, ketones,quinones and the like.

The terms silicon-containing substance, electrically conductivesubstance, insulating substance, hydrophilic substance, lipophilicsubstance and substance having a specific group may in some cases referto the same substance.

The CNT material may as necessary be used for any application for whichCNT materials are or could be used, such as electrical products,electronics, machines and the like, but the superior electrical andthermal characteristics of CNT materials make them particularly suitedfor aerospace and medical applications in which electromagnetic wavesmay be generated, or portable electronic instruments (including portablephones, personal computers and other portable electronic terminals), orelectronic components and devices (such as semiconductor integratedcircuit devices including semiconductor devices and printed wiringboards). They are also expected to provide long-term durable,high-performance, electrically conductive members (sheets, etc.) forelectronic devices, and electromagnetic shielding members (sheets, etc.)with little degradation, as well as electronic components and devicesthat are resistant to problems such as peeling and circuit breakage.Examples of such electronic components include heat dissipation bumpsfor electronic device assembly, multilayer wiring for semiconductordevices (electronic devices), wiring vias for semiconductor devices(electronic devices) and the like.

In addition, the surface modified carbon nanotube material is alsoapplicable not only to the aforementioned electronic components,electronic device elements and the like, but also for example to (flator curved) aerospace applications and medical instruments which requirehigh electrical and thermal conductivity relative to weight, as well asto portable phones, personal computers, other electronics that generateelectromagnetic waves, electrically conductive sheets, high-frequencyelectromagnetic shielding materials for electronic terminals, andprecursors (so-called prepregs) for preparing these components.

FIG. 4 shows a model cross-section of a semiconductor integrated circuitdevice in which the CNT material of one embodiment is used for the LSIwiring vias. In FIG. 4, multiple transistors 42 and other elements arepacked into silicon substrate 41, with multiple insulating layers(interlayer insulating films) 43 a through 43 f formed over them. Theinsulating layers are interspersed with wiring layers, and certain wires45 of the wiring layers are connected to the wires 45 of other layers byvias 46, which are formed passing through the insulating layers. 47represents a contact that connects to wires 45 connecting elements toeach other. The topmost wiring layer is covered by protective layer 48.In the integrated circuit device shown in this drawing, the CNT materialis applied to vias 46, and by improving the wettability of thesenanotubes for a specific solvent, it is possible to improve theinfiltration of the dissolved SOG or other insulating resin around theCNTs, thereby preventing holes around the CNTs and fixing the CNTbundles so that the tops of the CNT material grown in the via can beproperly shaved by CMP to thereby achieve a good electrical connectionwith the wiring part.

FIG. 5 is a diagram showing an outline of the structure of an electronicdevice comprising a high-temperature conduction bump, wherein a CNTmaterial is used as the cooling bump material of an advanced electronicdevice, and in this case the CNT material can be applied as the coolingbump material of the advanced electronic device. For example, thesubstrate with CNTs of FIG. 5 can be treated with VUV in the presence ofa gas consisting of oxygen diluted with nitrogen or oxygen and a smallamount of water diluted with nitrogen, and the CNT part of this treatedsubstrate with CNTs can then be plated (wet treated) to prepare aso-called CNT hybrid bump structure having a thermally and electricallyconductive substance (metal such as Cu or Al, or the like) thoroughlypenetrating the gaps between the CNT chains. Next, an electronic devicecan be thermocompression bonded (preferably at about 250 to 450° C.) tothis treated substrate to prepare a highly thermally conductiveelectronic device using a CNT bump thoroughly permeated by a metal orthe like.

FIG. 6 is a diagram showing an electromagnetic shielding sheet orprepreg of one embodiment. That is, an electromagnetic shielding sheetor prepreg thereof can be obtained by scattering CNTs on a resin sheetand pasting that sheet to another resin sheet.

Based on the explanation above, a surface modified CNT material thesurface of which has been modified with at least one of asilicon-containing group and a silicon-containing compound can beconsidered to have similar effects as the surface modified CNT materialsof the aforementioned embodiments of the invention regardless of themethod used. More specifically, affinity in contact with asilicon-containing substance can be made better than that beforemodification. Affinity in contact with at least one substance selectedfrom the group consisting of the electrically conductive substances,insulating substances, hydrophilic substances, lipophilic substances andsubstances having specific groups can also be made better than thatbefore modification. Such a surface modified CNT material can also beapplied favorably to electronic components, particularly wiring vias,electronic device heat diffusion bumps, electrically conductive sheets,electromagnetic shielding sheets and/or prepregs for manufacturingelectromagnetic shielding sheets, thereby providing electronic deviceswith improved reliability.

For example, when SOG is permeated in the via structure by SOG coatingwhile preparing a via wiring structure formed from the surface modifiedCNT composite material of one embodiment in the process of manufacturinga semiconductor (electronic device), surface modification of the CNT viapart by a method of an embodiment allows SOG permeation to be greatlyimproved and the mechanical strength of the CNT via structure to begreatly enhanced in cases in which permeation would normally be poorbecause of poor affinity between the CNTs and the resin, solvent and thelike. In this way, the structure of this part is strong enough towithstand future CMP processing and other processes, improving processstability and manufacturing condition tolerances and improving thereliability of the finished product and the like. That is, affinity tomany silicon-containing substances can be improved by means of thesubstances, process conditions and the like used in a chemicalprocessing of various embodiments.

A prepreg of a composite material containing CNTs can also be made tohave more affinity to foreign materials in the same way. In the case ofa CNT composite (such as CNT+Cu) in which the CNTs are Cu plated inorder to further improve their thermal conductivity, the CNTs could bemade to have more affinity to a silicon-containing substance whilesimultaneously being made more hydrophilic for purposes of platingliquid permeation. In such cases, two kinds of affinity couldpotentially be achieved simultaneously by mixing oxygen, or an amine orother substance vapor (or mist) capable of conferring hydrophilicity ata suitable ratio with the silicon-containing substance vapor (or mist orthe like).

The various definitions, attributes and preferred embodiments used toexplain the surface modified CNT material in the aforementionedembodiments of the present invention can also be applied to otherembodiments of the present invention to the extent that they do notviolate the intent of the present invention.

EXAMPLES

Examples and Comparative Examples are explained next.

Example 1

Using as the substrate an Si wafer (p-type (100)) with 25 nm of Niformed thereon by sputtering, multi-wall CNTs were grown to about 3 μmat 650° C. by thermal CVD using acetylene gas as the raw material. Whenmeasured, the surface density of the nanotubes was about 5×10¹¹/cm².

This sample was first baked for 5 minutes at 400° C. in clean air toremove combustible impurities other than nanotubes from the nanotubesurfaces and was then transferred immediately to a processing unit inwhich tetramethylsilane (Si(CH₃)₄) as a specific substance was used as agas diluted with pure nitrogen to a vapor pressure of 1 atmosphere and aconcentration of about 5 vol %. The gas flow rate was 1 L/minute.

This was then exposed for 2 minutes to VUV using an excimer UV lamp withan output of 30 mW/cm² to generate Xe excimer UV (central wavelengthλ=172 nm). The structure of the unit was as in FIG. 2.

The XPS and IR spectra of this sample were analyzed before and afterthis treatment, and formation of silicon-carbon bonds not present in thenanotubes before the treatment was confirmed after the treatment.

When the same processes were performed but without VUV exposure, nosilicon-carbon bonds were found after processing.

Example 2

Using the same specific substance as in Example 1, and single-walledCNTs were produced by arc discharge on an Si wafer (p-type (100)) as thesample.

This was processed as in Example 1, except that the processing time was20% of that in Example 1.

The XPS and IR spectra of this sample were analyzed before and afterthis treatment, and formation of silicon-carbon bonds not present in thenanotubes before the treatment was confirmed after the treatment.

When the same processes were performed but without VUV exposure, nosilicon-carbon bonds were found after processing.

Example 3

A cylindrical hole pattern 0.5 μm in diameter and 1 μm deep was formedon an Si substrate, a 10 nm Ti thin film was formed by sputtering on theentire surface of the wafer including the bottoms of the hole pattern,Ni fine particles with an average particle size of 10 nm were scatteredacross the entire surface of the wafer including the bottoms of the holepattern, and multi-walled CNTs 1500 nm in length were grown by thermalCVD up to the tops of the holes. The surface density of the nanotubeswas measured as about 3×10¹¹/cm².

In use of the same unit as in Example 1, this sample was exposed to VUVas in Example 1 using a mixed gas of hexamethyldisilazane as a specificsubstance diluted with nitrogen at a volume ratio of 1%. The VUVexposure time was 200% of that in Example 1.

After processing, a 5% acetone solution of γ-aminopropylethoxysilane[H₂N(CH₂)₃Si(OCH₂CH₃)₃] (hereunder abbreviated as APES) was dripped ontothe sample, which after a while was dried thoroughly with a hot plate,and when the cross-section of the holes were observed by scanningelectron microscopy (SEM), the nanotubes were confirmed to be partiallybundled in the holes. This is thought to show what was the effect ofpermeation by the APES solution. That is, it is considered that becauseof the good wettability by the APES solution, the APES solution wettedthe nanotube surfaces, and the nanotubes were bound together by the APESsolution into bundles that remained after the APES solution hadevaporated. In this example, the electrical resistance between the uppersurface and lower surface (substrate surfaces) of the CNTs bundled bythe APES solution was a very low 1.5Ω (ohms).

By contrast, when an unprocessed nanotube sample in a hole pattern wasprocessed in the same way, there was very little change afterprocessing, and little bundling of the nanotubes, which were found to bestanding largely independently. That is, it was thought that because theunprocessed nanotubes had poor wettability by the APES solution, theAPES solution was repulsed from the nanotube surfaces, with the resultthat the nanotubes were not bound into bundles by the APES solution.

When nanotubes were cut off from processed and unprocessed samples andthe XPS and IR spectra were analyzed, silicon-carbon bonds not seen inthe nanotubes before processing were confirmed to have formed afterprocessing.

When TEOS (tetraethoxysilane, Si(OC₂H₅)₄) was deposited by CVD in placeof the aforementioned APES solution treatment, and the sample wasobserved by SEM, the TEOS was found to have filled the gaps well betweenthe grown nanotubes. When unprocessed nanotubes in a hole pattern wereprocessed in the same way and the cross-sections of the holes wereobserved by SEM, however, the TEOS had not filled in the gaps betweenthe grown nanotubes, and many cavities still remained.

From these results, it appears that these nanotubes have improvedwettability by the APES solution, indicating good affinity to solvents,adhesives and other substances having silicon-containing groups. WhileTEOS, SOG and Low-k resins are suitable materials for filling in thegaps between nanotubes grown on a substrate for example, still greatereffects can be obtained by improving the interfacial affinity to thenanotubes according to some embodiments.

Example 4

A 10 nm Ti thin film was formed by sputtering on the entire wafersurface of an Si substrate, after which Ni fine particles with anaverage particle size of 10 nm were scattered across the entire wafersurface, and a 2 μm×5 μm rectangular pattern was formed by opticallithography using a resist and developed, leaving the Ni fine particlesin a 2 μm×5 μm rectangular pattern.

Multi-walled CNTs 1500 nm in length were then grown thereon by thermalCVD to form a cubic structure of nanotubes. When measured, the surfacedensity of the nanotubes was about 2×10¹¹/cm².

Using a unit similar to that of Example 1, this sample was exposed toVUV as in Example 1 using a mixed gas of a specific substancetetramethylsilane (Si(CH₃)₄) diluted with nitrogen at a volume ratio of1%. The VUV exposure time was 300% of that in Example 1, however.

A solution of SOG (spin on glass) diluted with a 1:1 (volume ratio)mixed solution of ethanol and MIBK (methyl isobutyl ketone) was thendripped on this processed sample, rapidly spin coated, and thenthoroughly dried with a hot plate at 150° C. and then at 300° C., for 10minutes respectively.

When this was observed by scanning electron microscopy (SEM), the cubicstructure of the nanotubes was partially bundled, and SOG had permeatedbetween most of the nanotubes.

By contrast, when an unprocessed nanotube sample of the same structurewas treated in the same way, the nanotubes were found to be standingindependently with almost no bundling, and with the SOG covering them.That is, it is thought because the unprocessed nanotubes had poorwettability by the SOG solution, the spaces between the nanotubes werenot filled in by the SOG solution.

Example 5

A 10 nm Ti thin film was formed by sputtering on the entire wafersurface of an Si substrate, after which Ni fine particles with anaverage particle size of 10 nm were scattered across the entire wafersurface, and a 2 μm×5 μm rectangular pattern was formed by opticallithography using a resist and developed, leaving the Ni fine particlesin a 2 μm×5 μm rectangular pattern.

Multi-walled CNTs 1500 nm in length were then grown thereon by thermalCVD to form a cubic structure of nanotubes. When measured, the surfacedensity of the nanotubes was about 2×10¹¹/cm².

Using a unit similar to that used in Example 1, this sample was exposedto VUV as in Example 1 using a mixed gas of a specific substancetetramethylsilane (Si(CH₃)₄) and triethylamine diluted with nitrogen tovolume ratios of 1% and 0.3%, respectively. The VUV exposure time was400% of that in Example 1, however.

When the surface of this processed sample was analyzed by FT-IR and XPS,silicon-carbon bonds and nitrogen-carbon bonds were seen.

This processed sample was then treated as follows.

When CNTs of this processed sample were plated by being immersed in anaqueous Cu electroless plating solution, the Cu adhered around the CNTs.

A solution of SOG (spin on glass) diluted with a 1:1 (volume ratio)mixed solution of ethanol and MIBK (methyl isobutyl ketone) was thendripped on this processed sample, immediately spin coated and dried witha hot plate at 150° C. and then at 300° C., for 10 minutes respectively.As a result, a sample was obtained having a rectangular pattern of CNTand Cu on an Si substrate, embedded in SOG above and around the CNTs.

This processed sample was then CMP treated so that the pattern of CNTand Cu showed out of the SOG. This wafer sample can be used effectivelyas a heat diffusion “member” (“heat spreader”) of an LSI.

The same test was also performed without the processing of the presentinvention.

That is, a 10 nm Ti thin film was formed by sputtering on the entirewafer surface of an Si substrate, after which Ni fine particles with anaverage particle size of 10 nm were scattered across the entire wafersurface, and a 2 μm×5 μm rectangular pattern was formed by opticallithography using a resist and developed, leaving the Ni fine particlesin a 2 μm×5 μm rectangular pattern.

1500 nm-long multi-wall CNTs were then grown thereon by thermal CVD toform a cubic structure of nanotubes. When measured, the surface densityof the nanotubes was about 2×10¹¹/cm².

When the surface of the sample after processing was subjected to FT-IRand XPS analysis, there were found to be no silicon-carbon bonds ornitrogen-carbon bonds.

This processed sample was then treated as follows.

When CNTs of this processed sample were plated by being immersed in anaqueous Cu electroless plating solution, the CNTs were not sufficientlywetted by the plating solution, and the Cu did not adhere around theCNTs.

A solution of SOG (spin on glass) diluted with a 1:1 (volume ratio)mixed solution of ethanol and MIBK (methyl isobutyl ketone) was thendripped on this processed sample, immediately spin coated and dried witha hot plate at 150° C. and then at 300° C., for 10 minutes respectively.

When this processed sample was then CMP treated, “peeling” occurred atthe boundaries between the SOG and CNTs because there was not sufficientclose contact between the two, and a sample with a good pattern couldnot be prepared.

Example 6

A 10 nm Ti thin film was formed by sputtering on the entire wafersurface including the bottom faces of an Si substrate, and Ni fineparticles with an average particle diameter of 10 nm were then scatteredacross the entire wafer surface.

Multi-wall CNTs 1500 nm in length were then prepared by thermal CVDusing the same methods as in Example 4.

Using a unit similar to that used in Example 1, this sample was exposedto VUV as in Example 1 using as the specific substance a mixed gas oftetramethylsilane (Si(CH₃)₄) and oxygen diluted with nitrogen to volumeratios of 1% and 0.1%, respectively. The VUV exposure time was 400% ofthat in Example 1, however.

CNTs shaved off from this Si substrate ( 1/10000 wt %) were mixed with aliquid comprising 1/100 wt % AIBM (azobisisobutyronitrile) mixed withstyrene monomer, and this was carefully scattered in a thin layer on aPET (polyethylene terephthalate) film.

This was treated for 15 minutes at 65° C. in a nitrogen atmosphere, andpeeled off the PET film to prepare an electrically conductivepressure-sensitive adhesive sheet. By superimposing and pressing twosuch sheets, it was possible to prepare a hard and uniform electricallyconductive sheet.

When a tetramethylsilane (Si(CH₃)₄) mix gas which was the same as thepreviously used one except that tetramethylsilane was diluted by itselfin nitrogen without the oxygen, was used, the sample had cracks afterbeing peeled from the PET film, and it was not possible to form auniform sheet.

1-13. (canceled)
 14. A surface modified carbon nanotube materialmanufactured by a method comprising a combination of exposing a carbonnanotube material to ultraviolet rays and supplying a silicon-containingcompound to the carbon nanotube material, wherein the ultraviolet raysinclude only a wavelength component in the range of 10 to 200 nms, anddoes not include a wavelength component in the range longer than 200nms.
 15. A surface modified carbon nanotube material, the surface ofwhich is modified with at least one of a silicon-containing group and asilicon-containing compound.
 16. The surface modified carbon nanotubematerial according to claim 15, wherein the surface modified carbonnanotube material has better affinity when in contact with asilicon-containing substance than before modification.
 17. The surfacemodified carbon nanotube material according to claim 15, wherein thesurface modified carbon nanotube material has better affinity when incontact with at least substance selected from the group consisting ofthe electrically conductive substances, insulating substances,hydrophilic substances lipophilic substances and substances havingspecific groups than before modification.
 18. An electronic componentcomprising the surface modified carbon nanotube material according toclaim
 15. 19. The electronic component according to claim 18, whereinthe electronic component is a wiring via, electronic device heatdissipation bump, electrically conductive sheet, electromagneticshielding sheet, or a prepreg for manufacturing the sheets.
 20. Anelectronic device comprising the surface modified carbon nanotubematerial according to claim
 15. 21. An electronic component comprisingthe surface modified carbon nanotube material according to claim
 17. 22.The electronic component according to claim 21, wherein the electroniccomponent is a wiring via, electronic device heat dissipation bump,electrically conductive sheet, electromagnetic shielding sheet, or aprepreg for manufacturing the sheets.
 23. An electronic devicecomprising a surface modified carbon nanotube material according toclaim 17.